tools = [
  {
    name: 'AET RTA',
    blockStr: '30 min',
    process: [
      'GaAs anneal',
      'GaN anneal',
      'Si anneal',
      'InP anneal',
      'ITO anneal',
      'Unlisted material'
      ]
    },
  {
    name: 'CGA Stepper',
    blockStr: '30 min',
    process: []
    },
  {
    name: 'Disco Dicing Saw',
    blockStr: '1 hour',
    process: [
      'Si substrate',
      'GaAs substrate',
      'Sapphire substrate',
      'InP substrate',
      'Quartz substrate',
      'Ceramic substrate',
      'Unlisted substrate'
      ]
    },
  {
    name: 'E-beam Evaporator #1',
    blockStr: '2 hours',
    process: [
      'Ag',
      'Al',
      'Al/Au',
      'Al/Au/Ni',
      'Au',
      'Au/Ge/Ni/Au',
      'Au/Ni',
      'AuGe',
      'AuGe/Ni/Au',
      'Cr',
      'Cr/Au',
      'Ge',
      'Ge/Au/Ge/Au/Ni/Au',
      'Ni',
      'Ni/Au',
      'Ni/Au/Ni',
      'Ni/AuGe/Ni/Au',
      'Ni/AuGe/Ni/Au/Ni',
      'Ni/Ge/Au/Ni',
      'Ni/Ge/Au/Ni/Au',
      'Ni/Ge/Au/Ni/Au/Ni',
      'Ni/Ti/Au',
      'NiCr',
      'Pd',
      'Pd/Au',
      'Pd/Au/Ni',
      'Pt',
      'Pt/Al',
      'Pt/Au',
      'Si',
      'Si/Ti/Au/Ti/Si',
      'Si/Ti/Si',
      'SiO2',
      'SiO2/Ag',
      'SiO2/Au/SiO2',
      'Ti',
      'Ti/Al/Ni/Au',
      'Ti/Al/Ti/Au',
      'Ti/Au',
      'Ti/Au/Ni',
      'Ti/Au/Si',
      'Ti/Au/SiO2',
      'Ti/Au/Ti',
      'Ti/AuGe/Ni/Au',
      'Ti/Ni',
      'Ti/Pt/Au',
      'Ti/Pt/Au/Ni',
      'Ti/Pt/Au/Si',
      'Ti/SiO2/NiCr',
      'Ti/TiO2',
      'TiO2',
      'Unlisted Material'
      ]
    },
  {
    name: 'FEI Sirion SEM',
    blockStr: '1 hour',
    process: []
    },
  {
    name: 'GCA Autostep200',
    blockStr: '30 min',
    process: []
    },
  {
    name: 'Panasonic ICP Etch',
    blockStr: '30 min',
    process: [
      'SiO2 etch - CHF3',
      'GaAs etch - BCl3/Cl2/Ar',
      'Ti - Cl2/Ar',
      'TiO2 - CHF3',
      'GaN - Cl2/BCl3/Ar',
      'SiN etch - CF4/O2/CHF3',
      'Ashing BCB',
      'Ashing PR',
      'Unlisted etch'
      ]
    },
  {
    name: 'PlasmaTherm PECVD',
    blockStr: '1 hour',
    process: [
      'SiNx, 250 deg C',
      'SiNx, 350 deg C',
      'SiO2, 250 deg C',
      'Unlisted Process'
      ]
    },
  {
    name: 'RIE #5',
    blockStr: '1 hour',
    process: [
      'AlGaAs etch',
      'AlSb etch',
      'GaAs etch',
      'GaN etch',
      'InAlAs etch',
      'InAs etch',
      'InP etch',
      'SiGe etch',
      'Unlisted material etch'
      ]
    },
  {
    name: 'Sputter #1 Single Chamber',
    blockStr: '2 hours',
    process: [
      'Al',
      'AlN',
      'Au',
      'Cr',
      'Cr/Au',
      'ITO',
      'Nb',
      'Ni',
      'Si',
      'Si/Au',
      'SiN',
      'SiO2',
      'Ti',
      'Ti/AlN',
      'Ti/Au',
      'Ti/Au/Ti',
      'W',
      'Unlisted Material'
      ]
    },
  {
    name: 'Sputter #2 Multi-Chamber',
    blockStr: '2 hours',
    process: []
    },
  {
    name: 'Unaxis VLR Etch & Dep',
    blockStr: '1 hour',
    process: [
      'Etch Characterization',
      'Training Session',
      'InP Etch',
      'Dep Characterization',
      'SiNx Deposition, SiH4/He',
      'SiO2 Deposition, SiH4/He',
      'SiNx Deposition, SiH4/Ar',
      'SiO2 Deposition, SiH4/Ar'
      ]
    }
  ];